Antimicrobial Adhesive Copper Film. Bubble Free. Guiding Grid Lines. US Seller

Description

Cu (Copper) Base ANTIMICROBIAL FILM
Effective Against Bacteria & Viruses
Cu film is 99.9% effective in killing bacteria,
yeasts, and viruses upon contact. This is a
patented product and is superior in preventing the spread of bacteria, fungi, parasites and viruses to all the alloy-based elements, including silver.
Airfree Adhesive Application
Unlike other films, the adhesive side of this film is made using the Airfree technology that utilizes a cross-hatching method to ensure less air bubbles from forming when applying the adhesive, making this film easy for anyone to apply.
Patented Technology.
To Increase Transparency
While other copper films have a more opaque look, hiding the original surface below the film, our film has higher transparency, resulting in a more sophisticated look once applied. The film is also resistant to fingerprints, dust, etc once applied, leaving a cleaner looking surface.
Adhesive Backing. No Tape Needed.
Removable back to expose adhesive. Not only is the backing easy to remove, it is a completely mess-free and safe process.
Guiding Grid Lines on the Back
So easy for a person with no expertise to cut down to the size they need.
Size Specification
Sheet: 15.98" x 15.74" (40.6cm x 40cm)
Roll: 15.98" x 32.80' (40.6cm x 10m)